By A. Fletcher
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Extra resources for Advanced Organics for Electronic Substrates and Packages
Other companies include Plaskon Ine, Hysol and Nitto Ltd. 4 PACKAGING The performance of electronic systems is increasingly limited by the packaging system and many new packaging technologies have arisen, ranging from SMT to MCMs. These developments have created opportunities for cost and performance improvements but have complicated design and production. In the selection of a packaging system there is rarely one solution which offers excellent performance and minimal cost; there is always a trade-off between cost and performance.
The back side of the wafer is then etched away to leave a thin polyimide diaphragm with the X-ray absorbing pattern. The good dimensional stability of polyimide and its transparency to X-rays make it well suited to this application. Hoya is developing phase shift masks which, though more costly to manufacture than conventional masks, can be used in existing patterning machines. 3 microns. The system has no lenses and suffers no chromatic aberration so that, theoretically, it could expose masks of any size.
Impregnation coating is used with a cavity filling or conformai coating 47 Advanced Organics process and involves the saturation of a low viscosity resin to the component, which also includes a thin film coated on the component surface. In dip coating the component is dipped into an encapsulant resin which is then withdrawn, dried and cured. Coating thickness is usually a function of resin viscosity, withdrawal rate and temperature of the resin. The most common method for IC device encapsulation is conformai coating, although spin coating and flow coating are also used.
Advanced Organics for Electronic Substrates and Packages by A. Fletcher